Cover Story:

Trillions of Sensors on the Earth by 2020

Headlines:

• Sensor & MEMS Market “Who is making What”

• Two Top Market Segments
• Low-cost IoT-focused devices “Tiny but includes high accuracy types”
• Industrial sensing “Mainly Ruggedized Modules”
• What are Sensors & MEMS sensing?
• Markets and Applications
• Arenas with Significant New Sensor innovation Opportunities
• Products, Technology and Vendor Evolution
• Where are the missing 41 billion IoT devices of 2019 Forecast?
• Tables: 35 Vendors by Application with direct links
• Research Institutes & Universities mentioned in this article
• Tribute to FAIRCHILD Semiconductor & Dr. Janusz Bryzek
• Conclusion

• Small-size and Highly Accurate Sensors from Texas Instruments
• Comparing Sensors & MEMS
• Future Impacts of New Sensor Technologies

• Sensing Tiny Things
• Demographic: type of sensors by physical measurement
• Trillions of Sensors Will Integrate and Inform Future Smart Systems
• Arenas With Significant New Sensor innovation Opportunities
• New Sensor Integration Enables New Value Creation Through Complex Interactions

• Competing Suppliers Target Segments With an Array of Sensor Types

• Five Defining Moments and Trends in Sensors in 2019

• AMS acquires 59% of Osram shares
• Neuromorphic sensing: A brainy direction
• Ex-InvenSense execs form UltraSense
• The influence of the piezo effect
• At the edge

Sensor & MEMS Vendors in this Edition

ACEINNA, Allegro, AMS, Analog Devices, Avago, Bosch, Broadcom, Canon, Emerson, Epson, eXo Imaging, Fairchild, GE, Honeywell, HP, iniLabs, iniVation, Intel, InvenSense, Libelium, Maxim, MediaTek, Microchip, Monnit, Murata, NXP, ON Semi, Osram, Panasonic, Prophesee, Qualcomm, Renesas, Seiko Epson, STMicroelectronics, TDK Epcos, TE connectivity, Texas Instruments, thinfilm, Toshiba, UltraSense, Vayyar, Vesper, XSENSE

50 Sensor & MEMS Companies in this Edition

Vendors: ACEINNA, Allegro, AMS, Analog Devices, Avago, Bosch, Broadcom, Canon, Emerson, Epson, eXo Imaging, Fairchild, GE, Honeywell, HP, iniLabs, iniVation, Intel, InvenSense, Libelium, Maxim, MediaTek, Microchip, Monnit, Murata, NXP, ON Semi, Osram, Panasonic, Prophesee, Qualcomm, Renesas, Seiko Epson, STMicroelectronics, TDK Epcos, TE connectivity, Texas Instruments, thinfilm, Toshiba, UltraSense, Vayyar, Vesper, XSENSE

Research Centers: CEA-Leti, ETH Zurich, Fraunhofer, Imec, National Science Foundation, UC-Berkeley Sensor & Actuator Center, Vision Institute (CNRS, UPMC, INSERM)

Cover Story:

Global Top 10 Analog IC Vendors

TI remains top, Infineon moves to N°3, ST is big gainer

Headlines:

• STMicroelectronics charts path to $12bn
• SPARK Microsystems winner of the 6th annual Nokia Open Innovation Challenge for its revolutionary ultra-low power and ultra-short latency wireless platform
• NXP to acquire Marvell's WiFi and Bluetooth Connectivity Assets
• Huawei's chipmaking ambitions at risk after Arm cuts ties. Move by key UK chip designer chokes off crucial intellectual property rights
• Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform
• TI: Temperature monitoring and protection
  Design considerations for smarter, smaller and high-accuracy temperature sensors to enable enhanced system performance and control.
• Making virtual more of a reality with the New Arm Mali-D77 Display Processor
• Analog Devices RapID Platform TSN Evaluation Kit
• New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile & Surveillance Markets
• Texas Instruments: One-page Overview & Dashboard
• STMicroelectronics Makes IoT Sensing Accessible with IoT Plug and Play, Ready to Connect to Microsoft Azure
• Infineon to acquire Cypress, strengthening and accelerating its path of profitable growth
• MagnaChip and ELAN Microelectronics Announce Partnership to Expand OLED Display Capabilities for Next-Generation Applications
• Hearables: Bosch brings smart features to your ear
• Mitsubishi Electric to Launch Large DIPIPM+ Series. Transfer-Molded Intelligent Power Modules Rated up to 100A/1200V for 56kW-Class Inverters

• Ampere and Packet Partner to Expand Adoption of eMAG™ Processors for Next-Generation Cloud and Edge Workloads
• DENSO becoming a shareholder of Infineon!
  Is this a replication of Softbank and ARM?
• Andes Technology Announces RISC-V Single-core and Multicore Processors with DSP Instruction Set
• Arm Unveils Neoverse N1 Platform with up to 128-Cores
• STMicroelectronics: MEMS motion / temperature sensor for wearables and IoT nodes
• Infineon New IGBT 3,3kV 450A Power Modules for Compact
  and Scalable Inverter Designs
• Infineon acquires Siltectra, a specialist for silicon carbide
• Laird Thermal Systems: Keep your devices cool From small components up to large systems – and -
  Appoints Dr. Karine Brand as CEO
• Imagination Technologies: GPUs and Virtualization Boost Performance for ADAS Platforms
• Digital Twins Deciphered by SEMICONDUCTOR Engineering
• BYD China Automotive Selects Analog Devices' Audio Bus
  and Processor Technologies to Improve Vehicle Energy Efficiency and Enhance Infotainment Experience
• NXP and Identiv Make IoT Applications More Accessible
  with Ultra-Low-Cost NFC Inlay
• New Arm technology will strengthen driver trust
  on the road to safe mass autonomous deployment
• DIODES Inc., Fast-Dimming, 60-V Linear LED Controller
  Targets Automotive Lighting
• Wind River Ranked Global Leading Provider of Embedded Operating Systems

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