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Cover Story:

Global Top 10 Analog IC Vendors

TI remains top, Infineon moves to N°3, ST is big gainer



  • STMicroelectronics charts path to $12bn
  • SPARK Microsystems winner of the 6th annual Nokia Open Innovation Challenge for its revolutionary ultra-low power and ultra-short latency wireless platform
  • NXP to acquire Marvell's WiFi and Bluetooth Connectivity Assets
  • Huawei's chipmaking ambitions at risk after Arm cuts ties. Move by key UK chip designer chokes off crucial intellectual property rights
  • Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform
  • TI: Temperature monitoring and protection
    Design considerations for smarter, smaller and high-accuracy temperature sensors to enable enhanced system performance and control.
  • Making virtual more of a reality with the New Arm Mali-D77 Display Processor
  • Analog Devices RapID Platform TSN Evaluation Kit
  • New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile & Surveillance Markets
  • Texas Instruments: One-page Overview & Dashboard
  • STMicroelectronics Makes IoT Sensing Accessible with IoT Plug and Play, Ready to Connect to Microsoft Azure
  • Infineon to acquire Cypress, strengthening and accelerating its path of profitable growth
  • MagnaChip and ELAN Microelectronics Announce Partnership to Expand OLED Display Capabilities for Next-Generation Applications
  • Hearables: Bosch brings smart features to your ear
  • Mitsubishi Electric to Launch Large DIPIPM+ Series. Transfer-Molded Intelligent Power Modules Rated up to 100A/1200V for 56kW-Class Inverters

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